BERGQUIST® SIL PAD® TSP Q2500

BERGQUIST® SIL PAD® TSP Q2500 is a composite of aluminium foil coated on both sides with thermally/electrically conductive Sil-Pad® rubber. The material is designed for those applications where maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds, eliminating problems associated with grease, such as contamination of reflow solder or cleaning operations. Unlike grease, this product can be used prior to these operations. It also eliminates dust collection, which can cause possible surface shorting or heat build-up.