BERGQUIST® SIL PAD® TSP Q2500
Connu sous le nom de Q-Pad® II
Caractéristiques et avantages
This thermally conductive, aluminium foil-coated pad is designed for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.
BERGQUIST® SIL PAD® TSP Q2500 is a composite of aluminium foil coated on both sides with thermally/electrically conductive Sil-Pad® rubber. The material is designed for those applications where maximum heat transfer is needed and electrical isolation is not required. It is an ideal thermal interface material to replace messy thermal grease compounds, eliminating problems associated with grease, such as contamination of reflow solder or cleaning operations. Unlike grease, this product can be used prior to these operations. It also eliminates dust collection, which can cause possible surface shorting or heat build-up.
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Informations techniques
| Conductivité thermique | 1.2 W/mK |
| Couleur | Rose |
| Température de service | -60.0 - 180.0 °C |
BERGQUIST® SIL PAD® TSP Q2500
This thermally conductive, aluminium foil-coated pad is designed for applications where maximum heat transfer is needed but electrical isolation is not required. Low thermal impedance.