BERGQUIST® LIQUI BOND TLB SA1800
Features and Benefits
This silicone based, thermally conductive liquid adhesive is ideal for automated pattern dispensing in electronic systems.
BERGQUIST® LIQUI BOND TLB SA1800 is a 1-part, silicone based, thermally conductive liquid adhesive which cures at elevated temperatures. It exhibits medium viscosity, which allows for ease and robust dispensing and offers high strength bonds, eliminating the need for mechanical fasteners. You can also expect mild elastic properties, which assist in relieving CTE (Coefficient of Thermal Expansion) stresses during thermal cycling. The high shear strength of the bond ensures stability even in severe environmental conditions.
- High thermal conductivity: 1.8W/m-K
- Eliminates need for mechanical fasteners
- Medium Viscosity for easy and robust dispensing
- Maintains structural bond in severe-environment applications
Documents and Downloads
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Additional Documents
Technical Information
| Color | Black |
| Dielectric constant, @ 1kHz | 6.0 |
| Flame rating | V-0 |
| Phase change temperature | 52.0 °C |
| Thermal conductivity | 1.8 W/mK |
| Volume resistivity | 1×10 Ohm m |
BERGQUIST® LIQUI BOND TLB SA1800
This silicone based, thermally conductive liquid adhesive is ideal for automated pattern dispensing in electronic systems.