BERGQUIST® LIQUI BOND TLB SA1800

Connu sous le nom de Liqui-Bond® SA 1800

Caractéristiques et avantages

This silicone based, thermally conductive liquid adhesive is ideal for automated pattern dispensing in electronic systems.
BERGQUIST® LIQUI BOND TLB SA1800 is a 1-part, silicone based, thermally conductive liquid adhesive which cures at elevated temperatures. It exhibits medium viscosity, which allows for ease and robust dispensing and offers high strength bonds, eliminating the need for mechanical fasteners. You can also expect mild elastic properties, which assist in relieving CTE (Coefficient of Thermal Expansion) stresses during thermal cycling. The high shear strength of the bond ensures stability even in severe environmental conditions.
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Informations techniques

Conductivité thermique 1.8 W/mK
Constante diélectrique, @ 1kHz 6.0
Cote d'inflammabilité V-0
Couleur Noir
Résistivité volume 1×10 Ohm m
Température de changement de phase 52.0 °C